12/15/2009
EE Times Europe
LONDON — Wireless chip company ST-Ericsson NV (Geneva, Switzerland) has demonstrated handover between LTE and HSPA networks using multimode LTE/HSPA silicon. The interoperability was realized in live networks belonging to Ericsson in Stockholm, Sweden, using multimode equipment powered by ST-Ericsson’s M710 platform.
The chipset used within ST-Ericsson’s M710 platform is commercially available and the handset and network equipment used in the Stockholm test met the 3GPP Release 8 March standard.
“With multimode devices consumers can enjoy new high-speed mobile broadband services and global coverage right from the launch of LTE services,” said.
“Seamless roaming between LTE and today’s networks is a key device capability to enable faster introduction of LTE,” said Joergen Lantto, chief technology officer of ST-Ericsson, in a statement.
“Ericsson is in the lead of the LTE development and together with the rest of the industry we will provide a true ecosystem for mobile broadband,” said Ulf Ewaldsson, head of product area radio at Ericsson, in the same statement.
